0.4mm Metal Core HDI Ceramic PCB Board

Place of Origin China
Brand Name Huashengxin
Certification UL , ISO9001
Model Number ED9A8063
Minimum Order Quantity 1pcs
Packaging Details vacuum
Delivery Time fastest 24 hours for 2L and 4L prototype, 3 days for HDI board production
Payment Terms T/T

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Whatsapp:0086 18588475571

Wechat: 0086 18588475571

Skype: sales10@aixton.com

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Product Details
PCB Name Coil ​PCB Ceramic Printed Circuit Board Marterial FR-4;High TG FR-4; Ceramic Base Material
Surface Finished Immersion Gold, LF-HASL, OSP... Board Thickness 0.4mm-4.0mm
Copper Thickness 18um-105um Solder Mask Green;blue;black;red...
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HDI Ceramic PCB Board

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0.4mm Ceramic PCB Board

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0.4mm Metal Core PCB

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Product Description

0.4mm Metal Core HDI Ceramic PCB Board

 

Ceramic PCB Board Coil ​PCB Ceramic Printed Circuit Board High Density PCB Metal Core PCB

 

Coil ​PCB Ceramic Printed Circuit Board

 

Ceramic PCB is a kind of heat conducting ceramic powder and organic binder, and the heat conduction organic ceramic PCB is prepared at a thermal conductivity of 9-20W/m. In other words, ceramic PCB is a printed circuit board with ceramic base material, which is highly thermally conductive materials such as alumina, aluminum nitride, as well as beryllium oxide, which can make a quick effect on transferring heat away from hot spots and dissipating it over the whole surface. What’s more, ceramic PCB is fabricated with LAM technology, which is a laser rapid activation metallization technology. So ceramic PCB is highly versatile that can take place of the entire traditional printed circuit board with a less complicated construction with enhanced performance.

 

Ceramic printed circuit boards have a wide range of applications and can be used in the LED field, solar panel components, high-power power semiconductor modules, semiconductor refrigerators, electronic heaters, power control circuits, power hybrid circuits, smart power components, high-frequency switching power supplies , solid state relays, automotive electronics, communications, aerospace and military electronic components.

 

tems Normal standard
Material FR-4;High TG FR-4; Ceramic base material
Layer NO. 1-20
Board Size 50mm*50mm-560mm*640mm
Board Thickness 0.4mm-4.0mm
Thickness Tolerance ±10%
Min Hole Size 0.15mm
Copper Thickness 18um-105um
Copper Plating hole 18um-30um
Min Trace Width 0.1mm
Min Space Width 0.1mm
Solder Mask Color green;blue;black;red...
Surfae Immersion gold, LF-HASL, OSP...
Outline profile CNC; V-CUT; Punching
Impedance Control ±10%
certificate ISO9001

 

0.4mm Metal Core HDI Ceramic PCB Board 0

FAQ:

 

1. What service can you provide?

Printed Circuit board, Printed Circuit Assembly, Rapid Prototype order

 

2. How fast is your lead time?

HDI board fastest 3 WDs, 2L and 4L Rigid board fastest 24H

 

3. How to get quick quotation?

Please provide gerber file and details of the board(including layer, board thickness, copper thickness, surface treatment, solder mask and silkscreen color, special request if any, demand quantity, etc)

 

Sample list:

PCB Layer 4L
PCB surface ENIG
PCB material FR4, TG135
finished Copper thickness 2/2/2/2oz
solder mask color Double side, red
Silkscreen Double side, black
Quantity 1000pcs, 2 weeks

 

4.What payment terms do you accept?

A: Wire Transfer(T/T) or Letter of Credit(L/C) or Paypal(only for small value less than 500usd)