FR4 TG170 HDI PCB Board 3mil Immersion Gold Lead Free Pcb OEM ODM

FR4 TG170 HDI PCB Board 3mil Immersion Gold Lead Free Pcb OEM ODM

HDI PCB Board HDI Circuit Boards Rohs PCB PCB And PCBA FR4 PCB Board PCB Printed Circuit Board Assembly

6L 1+N+1 HDI PCB

High-density interconnect (HDI) PCBs are characterized by finer lines, closer spaces, and more dense wiring. They have a faster connection while reducing the size of a project. Normally, these boards also feature blind and buried vias, laser ablated microvias, sequential lamination, and via in-pads. A HDI board can house the functionality of the previous boards used. 

HDI Board Stack-up:

1+N+1 with laser microvia and mechanical buried core via. The “1” represents “build-up” or sequential lamination on each side of the core.
i+N+i (i>=2) PCBs contain 2 or more “build-up” of high-density interconnect layers. Microvias on different layers can be staggered or stacked. Copper filled stacked microvia structures are commonly seen in challenging designs.

HSX products cover 1~32L FR-4 PCB, IMS PCB,HDI Boards, high frequency PTFE boards and Rigid-flex boards etc. It provides flexible quick turn production services (12 hours to72 hours), as well as small volume to big volume PCB manufacturing.Products are widely used in high-tech fields such as communications, power supplies, computer networks, digital products, industrial control, science and education, medical devices, and aerospace.