4 Layer HDI Printed Circuit Boards 1.6mm Green Solder Mask 3mil

4 Layer HDI Printed Circuit Boards 1.6mm Green Solder Mask 3mil

HDI PCB Board 4 Layer Pcb Board HDI Printed Circuit Board HDI PCB Design PCB Manufacturing And Assembly

4L 1+N+1 HDI PCB

HDI PCB are abbreviation of  high density interconnect printed circuit boards, they are characterized by finer lines, closer spaces, and more dense wiring.

For HDI boards own higher circuit density than traditional circuit boards, its designs can include smaller through holes and capture pads, and also higher connection pad density. They are widely used to reduce the weight and overall dimensions of products, as well as to enhance the electrical performance of the device.

HDI boards are applied to wide range of industries, like digital devices, smartphones and tablets, automobiles, aircraft and other vehicles products. 

HDI Board Stack-up:

1+N+1 with laser microvia and mechanical buried core via. The “1” represents “build-up” or sequential lamination on each side of the core.
i+N+i (i>=2) PCBs contain 2 or more “build-up” of high-density interconnect layers. Microvias on different layers can be staggered or stacked. Copper filled stacked microvia structures are commonly seen in challenging designs.

HSX products cover 1~32L FR-4 PCB, IMS PCB,HDI Boards, high frequency PTFE boards and Rigid-flex boards etc. It provides flexible quick turn production services (12 hours to72 hours), as well as small volume to big volume PCB manufacturing. Products are widely used in high-tech fields such as communications, power supplies, computer networks, digital products, industrial control, science and education, medical devices, and aerospace. HSX owns high-educated and experienced team and advanced production equipment.