2.0mm Enig Finish Pcb Ceramic Base Immersion Gold High Density PCB

Place of Origin China
Brand Name Huashengxin
Certification UL , ISO9001
Model Number ED9A8044
Minimum Order Quantity 1pcs
Packaging Details vacuum
Delivery Time fastest 24 hours for 2L and 4L prototype, 3 days for HDI board production
Payment Terms T/T

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Whatsapp:0086 18588475571

Wechat: 0086 18588475571

Skype: sales10@aixton.com

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Product Details
PCB Name Enig Finish Pcb Ceramic Base Marterial FR-4;High TG FR-4; Ceramic Base Material
Surface Finished Immersion Gold, LF-HASL, OSP... Board Thickness 2.0mm
Copper Thickness 18um-105um Solder Mask Green;blue;black;red...
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2.0mm Enig Finish Pcb

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18um Enig Finish Pcb

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2.0mm High Density PCB

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Product Description

2.0mm Enig Finish Pcb Ceramic Base Immersion Gold High Density PCB

 

Ceramic PCB Board ENIG Ceramic Base Printed Circuit Board Ceramic Base Material High Density PCB High Thermal Conductor

 

Immersion Gold Ceramic Printed Circuit Board

 

Ceramic PCB have good high-frequency and electrical performance, and have high thermal conductivity, excellent chemical and thermal stability. Excellent corrosion resistance, it widely used in semiconductor and microelectronic circuit packaging pcb, High-brightness Led chip carrier board, automotive electronics and lighting components, high-power electronic component heat dissipation materials, etc.

Ceramic PCBs provide best source of reacting point for printed circuits due to two reasons, high thermal conductivity and low coefficient of thermal expansion (CTE). The ceramic PCB is highly unique and useful because it is a complete replacement of traditional printed circuit boards having simple structure and increased performance.

Characteristics of Ceramic PCB:


1. Ceramic printed circuit boards are excellent heat conductors.
2. Ceramic circuit boards are not easily eroded by chemicals.
3. Ceramic PCBs provide a high level of mechanical compatibility.
4. High-density outlining is simple on ceramic boards.
5. Their CTA component compliance is excellent.

 

tems Normal standard
Material FR-4;High TG FR-4; Ceramic base material
Layer NO. 1-20
Board Size 50mm*50mm-560mm*640mm
Board Thickness 0.4mm-4.0mm
Thickness Tolerance ±10%
Min Hole Size 0.15mm
Copper Thickness 18um-105um
Copper Plating hole 18um-30um
Min Trace Width 0.1mm
Min Space Width 0.1mm
Solder Mask Color green;blue;black;red...
Surfae Immersion gold, LF-HASL, OSP...
Outline profile CNC; V-CUT; Punching
Impedance Control ±10%
certificate ISO9001

 

2.0mm Enig Finish Pcb Ceramic Base Immersion Gold High Density PCB 0

FAQ:

1. What service can you provide?

Printed Circuit board, Printed Circuit Assembly, Rapid Prototype order

 

2. How fast is your lead time?

HDI board fastest 3 WDs, 2L and 4L Rigid board fastest 24H

 

3. How to get quick quotation?

Please provide gerber file and details of the board(including layer, board thickness, copper thickness, surface treatment, solder mask and silkscreen color, special request if any, demand quantity, etc)

 

Sample list:

PCB Layer 4L
PCB surface ENIG
PCB material FR4, TG135
finished Copper thickness 2/2/2/2oz
solder mask color Double side, red
Silkscreen Double side, black
Quantity 1000pcs, 2 weeks

 

4.What payment terms do you accept?

A: Wire Transfer(T/T) or Letter of Credit(L/C) or Paypal(only for small value less than 500usd)