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High Frequency Rigid Flex Circuit Board FR4 High TG Immersion Tin PCB
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xProduct Details
| PCB Type | Rigid Flex PCB | Marterial | FR4, High TG, High Frequency, |
|---|---|---|---|
| Surface Finished | Immersion Tin, Immersion Silver, ENIG, ENEPIG, HASL, OSP, Hard Gold, Soft Gold | Board Thickness | 2.0mm |
| Min. Hole Size | 0.15mm | Other Service | PCB Assembly, Prototype Order |
| High Light | High TG Rigid Flex Circuit Board,FR4 Rigid Flex Circuit Board,Immersion Tin rigid printed circuit board |
||
Product Description
High Frequency Rigid Flex Circuit Board FR4 High TG Immersion Tin Pcb
Max layers: 32layer (≥20 layer needs to review)
Max finish panel size: 740* 500 MM(>600 MM needs to review)
PCB material: PI +FR4,FR4, Rogers,Halogen-free, High TG and heavy copper
PCB thickness: 0.2~4.0mm(＜0.2 mm,＞4 mm needs to review)
PCB copper thickness: H~5oz
Min. hole size: 0.15mm(＜0.15 mm needs to review)
Max hole size: 6.0mm(>6mm, use milling to enlarge holes)
HDI Min drill hole: 0.08-0.10MM
Min space in inner layer(one-sided): 4～8L(include): sample: 4 mil; small volume: 4.5 mil;
8~12L(include): sample: 5 mil; small volume: 5.5 mil
12～18L(include): sample: 6 mil; small volume: 6.5 mil
PCB solder mask: Green, Matt green,Blue, Matt blue, Black, Matt black, Yellow, Red, White,etc
PCB silkscreen: White, Black, etc
PCB surface: HASL lead free,Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger
Application: Communications, Industry/comsumer Electronic.
| PCB Layer | Rigid Flex PCB(4L) |
| PCB surface | Immersion gold |
| PCB material | FR-4, TG170+PI |
| PCB thickness | 2.0mm |
| Min. hole size | 0.2mm |
| Min. line Spacing | 3mil(0.075mm) |
| PCB profile |
Routing and V-CUT |
| PCB solder mask | Green, both side |
| PCB silkscreen | White, both sides |
| PCB copper thickness | 2/2/2/2oz finished |
| Other service | PCB assembly, prototype order |
Quick turn PCB manufacturing (2layer 24hours, 4layer 48hours…. Fastest )
FR4 , Aluminum, Flexible, Rogers, Teflon PCB mass production
Multi-Layered PC Board (4-32 layers)
Low to high volume surface mount and through-hole PCB assembly
01005s, BGA, uBGA, CCGA CSP and Flip Chip
0.4mm Fine Pitch Devices
Prototype and pre-production electronic assembly
Surface Mount Technology (Paste and Epoxy)
Encapsulation and conformal coating of PCB assemblies
Lead-Free assembly
Intrusive reflow
Press fit
Wave/Selective wave soldering
Double/Single-sided reflow processing
Rework and repairs (Fine Pitch QFP, Area Array Packages)
Functional, electrical, and in-circuit testing
By managing the end-to-end production process, we enable our customers to concentrate on their core specialties.
FAQ:
1. What service can you provide?
PCB Manufacture,PCB Assembly,Rapid Prototype
2. How fast is your lead time?
Fastest 24H for 2L and 4L, 3WDs for HDI board.
3. How to get quick quotation?
Please provide gerber file and details of the board(including layer, board thickness, copper thickness, surface treatment, solder mask and silkscreen color, special request if any, demand quantity, etc)
4. What payment terms do you have?
Wire Transfer(T/T)
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