| Project |
Processing capacity |
Process details |
| Laminate |
CEM-3, FR4 (low/medium/high TG, halogen-free), Rogers, Teflon, Arlon, metal substrate (aluminum substrate, copper substrate) |
|
| Material brand |
KB, Shengyi, NouYa, TUC, Isola, Rogers, Arlon , Taconic, Ventec |
Customers qualify the brand |
| Number of layers |
1-48 L |
|
| Maximum board size |
610x1060mm |
Dimensional tolerance ± 0.10mm |
| Special process |
Resin plug hole + hat plating, POFV, Rogers mixed pressure, blind buried hole, back drill, gold finger, bonding IC, blue glue, carbon oil, high temperature resistant glue |
|
| Board thickness |
0.2-6.0mm |
Conventional plate thickness:
0.2/0 4/0.6/0.8/1.0/1.2/1.6/2/2.5mm |
| Thickness tolerance |
T≥1.0mm, Tol: ±10%
T<1.0mm, Tol: ±0.1mm |
Special ± 8% |
| Finished inner copper thickness |
1/3-14OZ |
|
| Finished outer copper thickness |
1/3-12OZ |
|
| Through-hole single-sided welding ring |
4mil |
Via minimum 4mil, plated hole minimum 6mil |
| Laser drilling hole size |
0.1mm |
|
| Hole size tolerance (mechanical drilling) |
± 0.05mm (crimping hole). |
The standard tolerance for the finished aperture of mechanical drilling is ± 0.075mm, while the tolerance for crimping holes is ± 0.05mm |
| Minimum drill (mechanical drill) |
0.15mm |
Recommended design to 0.3mm or above |
| Min half-hole size |
0.40mm |
The half-hole process is a special process, and the minimum hole size shall not be less than 0.4mm. |
| Min. hole size(laser drill) |
0.10mm |
|
| Aspect ratio |
10:1 |
|
| Maximum NPTH hole (mechanical drilling) |
6.50mm |
|
| Minimum line width/line spacing |
Min.3/3mils (1ozCu finished) |
4/4Mil (finished copper thickness 1OZ),
5/6Mil (finished copper thickness 2OZ),
8/8Mil (finished copper thickness 3 OZ),
it is recommended to increase the line
width and spacing |
| Solder mask color |
Bright green, matte green, black, white, blue, red, yellow |
|
| Legend Mark height |
≥0.07mm |
Minimum Legend Mark height: at 0.07mm |
| Legend Mark linewidth |
≥0.1mm |
Minimum line width of Legend Mark: 0.1mm |
| Surface treatment |
ENIG, immersion silver, Immersion tin, HASL (Lead free or not), OSP, gold finger, carbon oil (low resistance/high resistance),
hard gold plating |
Immersion gold Au: 1-6μ "
Immersion Silver Ag: 0.15μm-0.5μm
Tin: 0.8-1.2μm
HASL: 1-40μ
OSP thickness: 0.20-0 50μm
Gold Finger Au: 5-60μ "
Hard Gold Plated Au: 5-60μ" |
| Bevel edge |
Bevel edge angle 20 °, 30 °, 45 ° |
|
| Carbon ink |
Carbon ink resistance value according to customer requirements
|
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