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Multilayer PCB

Copper Base PCB

Aluminum Base PCB

HDI PCB

High Frequency PCB

Server PCB

Industrial Control PCBs

Communications PCB

Power Supply PCB

Consumer Electronics PCB
equipments
applications
contact us
chat
home
about us
Company Profile
factory tour
quality control
FAQ
products

Multilayer PCB

Copper Base PCB

Aluminum Base PCB

HDI PCB

High Frequency PCB

Server PCB

Industrial Control PCBs

Communications PCB

Power Supply PCB

Consumer Electronics PCB
equipments
applications
contact us
chat

products details

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HDI PCB
Created with Pixso.

Customizable High Density Interconnect HDI PCB FR-4 Material Circuit Boards With VIPPO

Customizable High Density Interconnect HDI PCB FR-4 Material Circuit Boards With VIPPO

Customizable High Density Interconnect HDI PCB FR-4 Material Circuit Boards With VIPPO

Brand Name: LJC
MOQ: 10pcs
Price: Negotiable
Payment Terms: L/C, D/A, D/P, T/T, Western Union, MoneyGram
Detail Information
Product Description
Detail Information
Place of Origin:
China
Certification:
UL ISO IATF1
Material:
FR-4
Layout:
1-22 Layer
Surface Finish:
OSP
VIPPO:
Via-In-Pad Plated Over
Packaging Details:
Carton
Highlight:

Customizable FR-4 Material HDI PCB

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FR-4 High Density Interconnect HDI PCB

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Hdi Circuit Boards With VIPPO

Product Description
High-Density Interconnect (HDI) Technology
Characterized by microvias with a diameter ≤0.15mm, High-Density Interconnect (HDI) employs advanced fine-line patterning and microvia formation technologies to enable component interconnection within ultra-compact form factors. The architectural design—featuring minimized conductor geometries and optimized layer stacking—facilitates a wiring density an order of magnitude higher than conventional printed circuit boards (PCBs), critical for high-performance miniaturized systems.

 

Electrical performance is substantially enhanced through precise control of parasitic effects: reduction of residual stub inductance, elimination of discrete decoupling capacitors via integrated power/ground planes, and mitigation of crosstalk through controlled impedance routing. Furthermore, the strategic placement of adjacent ground planes—enabled by HDI’s thin dielectric layers—reduces radiated electromagnetic interference (RFI/EMI) by minimizing loop inductance and ensuring uniform distributed capacitance, thereby optimizing signal integrity across high-frequency transmission paths.
Tags: 

HDI PCB Board  

HDI Circuit Boards  

HDI Printed Circuit Board

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