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Customizable High Density Interconnect HDI PCB FR-4 Material Circuit Boards With VIPPO

Brand Name:	LJC
MOQ:	10pcs
Price:	Negotiable
Payment Terms:	L/C, D/A, D/P, T/T, Western Union, MoneyGram

Detail Information

Product Description

Detail Information

Place of Origin:

China

Certification:

UL ISO IATF1

Material:

FR-4

Layout:

1-22 Layer

Surface Finish:

OSP

VIPPO:

Via-In-Pad Plated Over

Packaging Details:

Carton

Highlight:

Customizable FR-4 Material HDI PCB

FR-4 High Density Interconnect HDI PCB

Hdi Circuit Boards With VIPPO

Product Description

High-Density Interconnect (HDI) Technology
Characterized by microvias with a diameter ≤0.15mm, High-Density Interconnect (HDI) employs advanced fine-line patterning and microvia formation technologies to enable component interconnection within ultra-compact form factors. The architectural design—featuring minimized conductor geometries and optimized layer stacking—facilitates a wiring density an order of magnitude higher than conventional printed circuit boards (PCBs), critical for high-performance miniaturized systems.

Electrical performance is substantially enhanced through precise control of parasitic effects: reduction of residual stub inductance, elimination of discrete decoupling capacitors via integrated power/ground planes, and mitigation of crosstalk through controlled impedance routing. Furthermore, the strategic placement of adjacent ground planes—enabled by HDI’s thin dielectric layers—reduces radiated electromagnetic interference (RFI/EMI) by minimizing loop inductance and ensuring uniform distributed capacitance, thereby optimizing signal integrity across high-frequency transmission paths.

Tags:

Multilayer PCB

Copper Base PCB

Aluminum Base PCB

HDI PCB

High Frequency PCB

Server PCB

Industrial Control PCBs

Communications PCB

Power Supply PCB

Consumer Electronics PCB